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Algorithmic and Knowledge-based CAD for VLSI
Gaynor Taylor
The Institution of Engineering and Technology, 1992
The continuing growth in the size and complexity of VLSI devices requires a parallel development of well-designed, efficient CAD tools. The majority of commercially available tools are based on an algorithmic approach to the problem and there is a continuing research effort aimed at improving these. The sheer complexity of the problem has, however, led to an interest in examining the applicability of expert systems and other knowledge based techniques to certain problems in the area and a number of results are becoming available. The aim of this book is to sample the present state-of-the-art in CAD for VLSI and it covers both newly developed algorithms and applications of techniques from the artificial intelligence community. The editors believe it will prove of interest to all engineers concerned with the design and testing of integrated circuits and systems.
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Semi-custom IC Design and VLSI
P.J. Hicks
The Institution of Engineering and Technology, 1983
The contents of this book were first presented as a series of lectures at the first IEE Vacation School on Semi-Custom IC Design and VLSI held at the University of Edinburgh on 4-8 July 1983. The earlier chapters provide an introduction to silicon IC technology and include descriptions of the various processing techniques employed in the manufacture of microelectronic components. Different types of semi-custom IC are then reviewed and the factors that have to be considered in choosing a semi-custom technique are examined in detail. Logic design is next presented as an activity that is best carried out at a higher level of abstraction than the customary/logic gate level by using the algorithmic state machine (ASM) method. In the sections that follow, computer aids to design and design automation tools are introduced as essential requirements for the rapid and error-free design of semicustom ICs. Testing strategies and the need to design for testability are also covered in some detail.
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Silicon Wafer Bonding Technology for VLSI and MEMS Applications
Subramanian S. Iyer
The Institution of Engineering and Technology, 2002
By bonding a thin wafer of active silicon to a thicker wafer via a layer of insulating oxide to form an SOI structure it is possible to substantially improve the performance and integration of microelectronic circuits produced by very large scale integration (VLSI). For example, the recently announced IBM Power 4 'server-ona- chip' integrates two microprocessors, a high bandwidth system switch, a large memory cache and input/output functions. SOI wafer bonding is also an enabling technology in the rapidly growing field of microelectromechanical systems (MEMS).
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VLSI Testing
Digital and mixed analogue/digital techniques
Stanley L. Hurst
The Institution of Engineering and Technology, 1998
The importance of testing integrated circuits (ICs) has escalated with the increasing complexity of circuits fabricated on a single IC chip. No longer is it possible to design a new IC and then think about testing: such considerations must be part of the initial design activity, and testing strategies should be part of every circuit and system designer's education. This book is a comprehensive introduction and reference for all aspects of IC testing. It includes all of the basic concepts and theories necessary for advanced students, from practical test strategies and industrial practice, to the economic and managerial aspects of testing. In addition to detailed coverage of digital network testing, VLSI testing also considers in depth the growing area of testing analogue and mixed analogue/digital ICs, used particularly in signal processing.
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