edited by Tai-Ran Hsu
The Institution of Engineering and Technology, 2004
eISBN: 978-1-84919-062-6 | Cloth: 978-0-86341-335-3 | Paper: 978-1-84919-061-9
Library of Congress Classification TK7875.M4576 2004
Dewey Decimal Classification 621.381

ABOUT THIS BOOK | TOC
ABOUT THIS BOOK
Written as a collective work by 14 outstanding microsystems packaging specialists from US industries, government laboratories and universities, MEMS Packaging provides a comprehensive view of the prevalent practices and enabling techniques in the assembly, packaging and testing of MEMS and microsystems. The book also addresses aspects of microassembly and testing technologies that are often overlooked.