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9 books match the query 'Integrated circuits'

cover of Algorithmic and Knowledge-based CAD for VLSI

Algorithmic and Knowledge-based CAD for VLSI

Gaynor Taylor

The Institution of Engineering and Technology, 1992

The continuing growth in the size and complexity of VLSI devices requires a parallel development of well-designed, efficient CAD tools. The majority of commercially available tools are based on an algorithmic approach to the problem and there is a continuing research effort aimed at improving these. The sheer complexity of the problem has, however, led to an interest in examining the applicability of expert systems and other knowledge based techniques to certain problems in the area and a number of results are becoming available. The aim of this book is to sample the present state-of-the-art in CAD for VLSI and it covers both newly developed algorithms and applications of techniques from the artificial intelligence community. The editors believe it will prove of interest to all engineers concerned with the design and testing of integrated circuits and systems.
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cover of Analogue-digital ASICs: Circuit techniques, design tools and applications

Analogue-digital ASICs

Circuit techniques, design tools and applications

R.S. Soin

The Institution of Engineering and Technology, 1991

The inexorable increase in levels of integration of electronic circuits has most often been exploited using digital signals. So much so that design engineers have sought to digitise analogue signals as early as possible in the signal processing chain, and performed digital processing wherever practicable.
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cover of Heat Management in Integrated Circuits: On-chip and system-level monitoring and cooling

Heat Management in Integrated Circuits

On-chip and system-level monitoring and cooling

Seda Ogrenci-Memik

The Institution of Engineering and Technology, 2016

As integrated circuits get smaller and more complex, power densities are increasing, leading to more heat generation. Dealing with this heat is fast becoming the most important design bottleneck of current and future integrated circuits, where power envelopes are defined by the ability of the system to dissipate the generated heat. Thermal effects are forcing chip designers to apply conservative design margins, creating sub-optimal results. At a larger scale, cooling is the second most costly item in the electricity bills of well-designed high-performance computing and data centers, costing 30-50% of the total. Thermal monitoring and management in integrated circuits is therefore becoming increasingly important.
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cover of I, Cyborg

I, Cyborg

Kevin Warwick

University of Illinois Press, 2002

Now available for the first time in America, I, Cyborg is the story of Kevin Warwick, the cybernetic pioneer advancing science by upgrading his own body.
 
Warwick, the world's leading expert in cybernetics, explains how he has deliberately crossed over a perilous threshold to take the first practical steps toward becoming a cyborg--part human, part machine--using himself as a guinea pig and undergoing surgery to receive technological implants connected to his central nervous system.
 
Believing that machines with intelligence far beyond that of humans will eventually make the important decisions, Warwick investigates whether we can avoid obsolescence by using technology to improve on our comparatively limited capabilities. Warwick also discusses the implications for human relationships, and his wife's participation in the experiments.
 
Beyond the autobiography of a scientist who became, in part, a machine, I, Cyborg is also a story of courage, devotion, and endeavor that split apart personal lives. The results of these amazing experiments have far-reaching implications not only for e-medicine, extra-sensory input, increased memory and knowledge, and even telepathy, but for the future of humanity as well.
 
 
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cover of Semi-custom IC Design and VLSI

Semi-custom IC Design and VLSI

P.J. Hicks

The Institution of Engineering and Technology, 1983

The contents of this book were first presented as a series of lectures at the first IEE Vacation School on Semi-Custom IC Design and VLSI held at the University of Edinburgh on 4-8 July 1983. The earlier chapters provide an introduction to silicon IC technology and include descriptions of the various processing techniques employed in the manufacture of microelectronic components. Different types of semi-custom IC are then reviewed and the factors that have to be considered in choosing a semi-custom technique are examined in detail. Logic design is next presented as an activity that is best carried out at a higher level of abstraction than the customary/logic gate level by using the algorithmic state machine (ASM) method. In the sections that follow, computer aids to design and design automation tools are introduced as essential requirements for the rapid and error-free design of semicustom ICs. Testing strategies and the need to design for testability are also covered in some detail.
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cover of Silicide Technology for Integrated Circuits

Silicide Technology for Integrated Circuits

Lih J. Chen

The Institution of Engineering and Technology, 2004

Silicide Technology for Integrated Circuits focuses on the task of developing and applying metal silicide technology as it emerges from the scientific to the prototype and manufacturing stages and provides guidance on the application of the latest emerging technology.
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cover of Silicon Wafer Bonding Technology for VLSI and MEMS Applications

Silicon Wafer Bonding Technology for VLSI and MEMS Applications

Subramanian S. Iyer

The Institution of Engineering and Technology, 2002

By bonding a thin wafer of active silicon to a thicker wafer via a layer of insulating oxide to form an SOI structure it is possible to substantially improve the performance and integration of microelectronic circuits produced by very large scale integration (VLSI). For example, the recently announced IBM Power 4 'server-ona- chip' integrates two microprocessors, a high bandwidth system switch, a large memory cache and input/output functions. SOI wafer bonding is also an enabling technology in the rapidly growing field of microelectromechanical systems (MEMS).
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cover of Technology Computer Aided Design for Si, SiGe and GaAs Integrated Circuits

Technology Computer Aided Design for Si, SiGe and GaAs Integrated Circuits

G.A. Armstrong

The Institution of Engineering and Technology, 2007

Technology Computer Aided Design for Si, SiGe and GaAs Integrated Circuits is the first book that deals with a broad spectrum of process and device design, and modelling issues related to various semiconductor devices. This monograph attempts to bridge the gap between device modelling and process design using TCAD. Many simulation examples for different types of Si-, SiGe-, GaAs- and InP-based heterostructure MOS and bipolar transistors are given and compared with experimental data from state-of-the-art devices. Bringing various aspects of silicon heterostructures into one resource, this book also presents a comprehensive perspective of the emerging field and covers topics ranging from materials to fabrication, devices, modelling and applications.
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cover of VLSI Testing: Digital and mixed analogue/digital techniques

VLSI Testing

Digital and mixed analogue/digital techniques

Stanley L. Hurst

The Institution of Engineering and Technology, 1998

The importance of testing integrated circuits (ICs) has escalated with the increasing complexity of circuits fabricated on a single IC chip. No longer is it possible to design a new IC and then think about testing: such considerations must be part of the initial design activity, and testing strategies should be part of every circuit and system designer's education. This book is a comprehensive introduction and reference for all aspects of IC testing. It includes all of the basic concepts and theories necessary for advanced students, from practical test strategies and industrial practice, to the economic and managerial aspects of testing. In addition to detailed coverage of digital network testing, VLSI testing also considers in depth the growing area of testing analogue and mixed analogue/digital ICs, used particularly in signal processing.
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