Power Electronics Packaging Reliability
edited by Mark Johnson
The Institution of Engineering and Technology, 2020
eISBN: 978-1-78561-253-4 | Cloth: 978-1-78561-252-7

ABOUT THIS BOOK
ABOUT THIS BOOK

Unpredictable fluctuating loads and exposure to widely varying environmental conditions (including heat, vibration, humidity and dust) present a particularly challenging environment for power electronics modules. This book describes the technologies involved in power electronic device manufacturing with an emphasis on characterising the key wear-out mechanisms and technologies to increase reliability. This book is a must-read for all engineers involved with electronics or reliable power systems.

More to explore: Evolution