79 books match the query 'Circuits' and 8 start with s

cover of SF6 Switchgear

SF6 Switchgear

H.M. Ryan

The Institution of Engineering and Technology, 1989

This book provides an extensive review of recent developments in SF6 Switchgear and covers fundamental properties of SF6 interrupter types, characteristics and associated operating mechanisms, arc modelling and computer aided methods for interrupter design and evaluation. The impact of SF6 Technology upon (i) Transmission Switchgear (ii) Distribution and Utility Switchgear and (iii) Regulations, Testing and Instrumentation is dealt with comprehensively.
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cover of Semi-custom IC Design and VLSI

Semi-custom IC Design and VLSI

P.J. Hicks

The Institution of Engineering and Technology, 1983

The contents of this book were first presented as a series of lectures at the first IEE Vacation School on Semi-Custom IC Design and VLSI held at the University of Edinburgh on 4-8 July 1983. The earlier chapters provide an introduction to silicon IC technology and include descriptions of the various processing techniques employed in the manufacture of microelectronic components. Different types of semi-custom IC are then reviewed and the factors that have to be considered in choosing a semi-custom technique are examined in detail. Logic design is next presented as an activity that is best carried out at a higher level of abstraction than the customary/logic gate level by using the algorithmic state machine (ASM) method. In the sections that follow, computer aids to design and design automation tools are introduced as essential requirements for the rapid and error-free design of semicustom ICs. Testing strategies and the need to design for testability are also covered in some detail.
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cover of Silicide Technology for Integrated Circuits

Silicide Technology for Integrated Circuits

Lih J. Chen

The Institution of Engineering and Technology, 2004

Silicide Technology for Integrated Circuits focuses on the task of developing and applying metal silicide technology as it emerges from the scientific to the prototype and manufacturing stages and provides guidance on the application of the latest emerging technology.
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cover of Silicon Wafer Bonding Technology for VLSI and MEMS Applications

Silicon Wafer Bonding Technology for VLSI and MEMS Applications

Subramanian S. Iyer

The Institution of Engineering and Technology, 2002

By bonding a thin wafer of active silicon to a thicker wafer via a layer of insulating oxide to form an SOI structure it is possible to substantially improve the performance and integration of microelectronic circuits produced by very large scale integration (VLSI). For example, the recently announced IBM Power 4 'server-ona- chip' integrates two microprocessors, a high bandwidth system switch, a large memory cache and input/output functions. SOI wafer bonding is also an enabling technology in the rapidly growing field of microelectromechanical systems (MEMS).
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cover of Simulation and Analysis of Circuits for Power Electronics

Simulation and Analysis of Circuits for Power Electronics

Muhammad H. Rashid

The Institution of Engineering and Technology, 2025

Power electronics play a vital role in many spheres, including integrating renewable energy, ensuring the reliability of complex power distribution systems, and in increasing efficiency of electric vehicles and industrial machines. Simulation of power electronic circuitry is thus a key and cost-effective means to detect and avoid problems during development of circuitry in power generation, distribution and use. This is true for both novel and established circuit designs.
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cover of Strained Silicon Heterostructures: Materials and devices

Strained Silicon Heterostructures

Materials and devices

C.K. Maiti

The Institution of Engineering and Technology, 2001

This book comprehensively covers the areas of materials growth, characterisation and descriptions for the new devices in siliconheterostructure material systems. In recent years, the development of powerful epitaxial growth techniques such as molecular beam epitaxy (MBE), ultra-high vacuum chemical vapour deposition (UHVCVD) and other low temperature epitaxy techniques has given rise to a new area of research of bandgap engineering in silicon-based materials. This has paved the way not only for heterojunction bipolar and field effect transistors, but also for other fascinating novel quantum devices. This book provides an excellent introduction and valuable references for postgraduate students and research scientists.
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cover of Switched Currents: An analogue technique for digital technology

Switched Currents

An analogue technique for digital technology

C. Toumazou

The Institution of Engineering and Technology, 1993

The switched-current technique is heralding a new era in analogue sampled-data signal processing. Unlike switched-capacitor circuits, switched-current circuits do not require linear floating capacitors or operational amplifiers and they are giving a renewed impetus to mixed-signal VLSI on standard digital technology. Key analogue designers from industry and academia worldwide have contributed to this first, very timely book entirely devoted to switched current analogue signal processing.
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cover of System-on-Chip: Next generation electronics

System-on-Chip

Next generation electronics

Bashir M. Al-Hashimi

The Institution of Engineering and Technology, 2006

System-on-Chip (SoC) is believed to represent the next major market for microelectronics, and there is a considerable interest world-wide in developing effective methods and tools to support the SoC paradigm. The field of SoC is broad and expanding and at present the technical and technological literature about the overall state-of-the-art in SoC is dispersed across a wide spectrum of books, journals, and conference proceedings. This edited book is an attempt to provide a comprehensive and accessible source of state-of-the-art information on existing and emerging SoC key research areas. In particular, the book covers the general principles and ideas of designing, validating and testing complex embedded computing systems and their underlying tradeoffs. Twenty-five international research groups have contributed to the book. Each contribution has an up-to-date survey highlighting the key achievements and future trends. To facilitate the understanding of the various topics covered in the book, each chapter has some background covering the basic principles, and extensive list of references. To enhance the book readability, the chapters are grouped into eight parts, each part examining a particular theme of SoC, including system design, embedded software, power management, reconfigurable computing, network-on-chip, verification and test. The book will be of interest to graduate students, designers and managers working in Electronic and Computer engineering.
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