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MEMS Packaging
edited by Tai-Ran Hsu
The Institution of Engineering and Technology, 2004
eISBN: 978-1-84919-062-6 | Cloth: 978-0-86341-335-3 | Paper: 978-1-84919-061-9
Library of Congress Classification TK7875.M4576 2004
Dewey Decimal Classification 621.381

ABOUT THIS BOOK | TOC
ABOUT THIS BOOK

Written as a collective work by 14 outstanding microsystems packaging specialists from US industries, government laboratories and universities, MEMS Packaging provides a comprehensive view of the prevalent practices and enabling techniques in the assembly, packaging and testing of MEMS and microsystems. The book also addresses aspects of microassembly and testing technologies that are often overlooked.

Aimed at professional engineers, scientists and technologists from industry, research laboratories and universities, the book examines every aspect of the assembly, packaging and testing of MEMS and microsystems, from essential enabling technologies to applications in the key industries of life sciences, telecommunication and aerospace engineering. The authors cover key topics such as bonding and sealing of microcomponents, process flow of MEMS and microsystems packaging, automated microassembly, RF telecommunications and aerospace applications.

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